Description: Slicing technology (English name: Cross-section, X-section) is the most commonly used sample preparation and analysis method for observing the cross-sectional structure of samples.Slicing analysis technology is often used in PCB/PCBA, parts and other manufacturing industries. It is usually used for quality judgment and quality abnormality analysis, inspection of circuit board quality, PCBA welding quality inspection, finding the cause and solution of failure, and evaluating the process. Improvement, as the basis for objective inspection, research and judgment, is also one of the commonly used methods for chip failure analysis.
Slice analysis steps: sampling→cleaning→vacuum mounting→grinding→polishing→microetching (if necessary)→analysis (OM observation, SEM observation, EDS analysis, EBSD analysis, etc.)
Slice test image:
