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Case
External Assessment
February 5th,2015

External Assessment

Appearance testing refers to confirming the number of chips received, inner packaging, humidity indication, desiccant requirements and proper outer packaging.Secondly, the appearance inspection of a single chip mainly includes: the typing of the chip, the year, the country of origin, whether it has been re-coated, the state of the pins, whether there are re-polishing traces, unknown residues, and the position of the manufacturer's logo.
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Ic Chip label verification
December 30th,2022

Ic Chip label verification

Check whether the label on the original package of the chip is consistent with the original product label.
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IC Chip Decapsulation Detection
December 30th,2022

IC Chip Decapsulation Detection

Uncapping (unsealing) mainly uses instruments to corrode the package on the surface of the chip to check whether there is a wafer inside, the size of the wafer, the manufacturer's logo, the year of copyright, and the wafer code, which can determine the authenticity of the chip.
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Ic Chip Function Testing
December 30th,2022

Ic Chip Function Testing

The key function test is also called the main function test, which refers to whether the device complies with the original specification under specific working conditions.
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Ic Chip X-ray Detection
December 30th,2022

Ic Chip X-ray Detection

Ic Chip X-ray test is a real-time non-destructive analysis of the hardware inside the component.
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Programming and Burning
December 30th,2022

Programming and Burning

The laboratory is equipped with a variety of programming equipment, which can support the programming test of 103,477 ICs produced by 405 IC manufacturers.
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Ic Chip Slice Test
December 30th,2022

Ic Chip Slice Test

Slicing technology (English name: Cross-section, X-section) is the most commonly used sample preparation and analysis method for observing the cross-sectional structure of samples.
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Solderability Test
August 29th,2015

Solderability Test

According to the test standard of solderability test, this test mainly detects whether the solderability of the chip pins is up to standard
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