Description: Uncapping (unsealing) mainly uses instruments to corrode the package on the surface of the chip to check whether there is a wafer inside, the size of the wafer, the manufacturer's logo, the year of copyright, and the wafer code, which can determine the authenticity of the chip.
Application scope: verification of chip authenticity and failure analysis, etc.
Open cover test picture:
Picture of uncapped test equipment :
Introduction to the uncap test
The uncap test, also known as DECAP, is a destructive experiment. It uses chemical reagents or laser etching to remove the outer packaging shell of the component to check the original logo, layout, and process on the surface of the grain. Defects, etc., the open cover test is an auxiliary test method.
Uncapping (unsealing) range
Ordinary packages COB, BGA, QFP, QFN, SOT, TO, DIP, BGA, COB ceramic, metal and other special packages.Generally, there are chemical (Chemical) unsealing, mechanical (Mechanical) unsealing, laser (Laser) unsealing, PlasmaDecap
Decap laboratory can handle almost all IC packaging forms (COB.QFP.DIPSOT, etc.), wire bonding type (AuCuAg).
Precautions for opening (unsealing)
1. All operations should be carried out in a fume hood, and acid-proof gloves should be worn.
2. The more the product is opened, the less acid it will drop to the end, and it should be cleaned frequently to avoid over-corrosion.
3. Be careful not to touch the surface of the gold wire and the chip with the tweezers during the cleaning process, so as not to scratch the chip and the gold wire.
4. According to the product or analysis requirements, the conductive adhesive under the chip or the second point should be exposed after uncapping.
5.In addition, in some cases, the uncapped products should be retested in rows.At this time, first put it under a microscope at 80 times to see if the gold wire on the chip is broken or tattered. If there is no wire, use a blade to scrape off the black film on the pin and send it for testing.
